Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/28/1999
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Application #:
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09026490
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Filing Dt:
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02/19/1998
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Inventors:
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HIDEHIKO KIRA, KENJI KOBAE, NORIO KAINUMA, NAOKI ISHIKAWA, SATOSHI EMOTO
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Title:
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METHOD OF PRODUCING A MULTICHIP PACKAGE MODULE IN WHICH ROUGH-PITCH AND FINE-PITCH CHIPS ARE MOUNTED ON A BOARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA 4-CHOME NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA, 211, JAPAN |
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| ARMSTRONG WESTERMAN HATTORI ET AL |
| WILLIAM F. ARMSTRONG |
| SUITE 1000 |
| 1725 K STREET, N.W. |
| WASHINGTON, DC 20006 |
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