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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
12/28/1999
Application #:
09018770
Filing Dt:
02/04/1998
Inventor:
AGOP H. CHERBETTCHIAN
Title:
SOLDER PLACEMENT APPARATUS AND METHOD
Assignment: 1
Reel/Frame:
008978/0098Recorded: 02/04/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/29/1998
Assignee:
21240 BURBANK BOULEVARD
WOODLAND HILS, CALIFORNIA 91367
Correspondent:
JOHN H. LYNN
2915 REDHILL AVENUE
SUITE 800
COSTA MESA, CA 92626
Assignment: 2
Reel/Frame:
025597/0505Recorded: 01/07/2011Pages: 399
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/04/2011
Assignee:
1840 CENTURY PARK EAST
LOS ANGELES, CALIFORNIA 90067-2199
Correspondent:
ALSTON & BIRD LLP
BANK OF AMERICA PLAZA
101 SOUTH TRYON STREET, SUITE 4000
CHARLOTTE, NC 28280-4000

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