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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
6010768
Issue Dt:
01/04/2000
Application #:
08854683
Filing Dt:
05/12/1997
Inventors:
TOSHIHIKO YASUE, YASUJI HIRAMATSU, HIDEKI YANO, YOSHIFUMI ISHITANI, YOICHIRO KAWAMURA et al
Title:
MULTILAYER PRINTED CIRCUIT BOARD, METHOD OF PRODUCING MULTILAYER PRINTED CIRCUIT BOARD AND RESIN FILLER
Assignment: 1
Reel/Frame:
008552/0752Recorded: 05/12/1997Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
YASUE, TOSHIHIKO
Exec Dt:
05/01/1997
HIRAMATSU, YASUJI
Exec Dt:
05/01/1997
YANO, HIDEKI
Exec Dt:
05/01/1997
ISHITANI, YASHIFUMI
Exec Dt:
05/01/1997
KAWAMURA, YOICHIRO
Exec Dt:
05/01/1997
MURASE, HIDEKI
Exec Dt:
05/01/1997
SUZUKI, AYUMI
Exec Dt:
05/01/1997
KAWADE, MASATO
Exec Dt:
05/01/1997
ASAI, MOTOO
Exec Dt:
05/01/1997
Assignee:
IBIDEN CO., LTD.
1, KANDA-CHO, 2-CHOME, OGAKI-SHI
GIFU 503, JAPAN
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
BRUCE H. BERNSTEIN
1941 ROLAND CLARKE PLACE
RESTON, VA 20191

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