Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2000
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Application #:
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08884504
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Filing Dt:
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06/27/1997
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Inventors:
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NORINAGA WATANABE, SHINICHI NISHI
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Title:
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PLASTIC MOLDED SEMICONDUCTOR PACKAGE AND A METHOD FOR PRODUCING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-3, KITASAIWAI 2, NISHI-KU |
| YOKOHAMA, JAPAN |
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| JACOBSON, PRICE, HOLMAN & STERN |
| JOHN C. HOLMAN |
| 400 7TH STREET, N.W. |
| WASHINGTON, D.C. 20004 |
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