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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	6022792	Issue Dt:	02/08/2000	Application #:	08815907	Filing Dt:	03/12/1997
Inventors:	KAZUTOSHI ISHII, NAOTO INOUE, KOUSHI MAEMURA, SHOJI NAKANISHI, YOSHIKAZU KOJIMA et al
Title:	SEMICONDUCTOR DICING AND ASSEMBLING METHOD

Assignment: 1

Reel/Frame:

010277/0473

Recorded: 10/01/1999

Pages: 2

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

ISHII, KAZUTOSHI

Exec Dt:

07/28/1997

INOUE, NAOTO

Exec Dt:

07/28/1997

MAEMURA, KOUSHI

Exec Dt:

07/28/1997

NAKANISHI, SHOJI

Exec Dt:

07/28/1997

KOJIMA, YOSHIKAZU

Exec Dt:

07/28/1997

KADOI, KIYOAKI

Exec Dt:

07/28/1997

AKIBA, TAKAO

Exec Dt:

07/28/1997

MOYA, YASUHIRO

Exec Dt:

07/28/1997

KUHARA, KENTARO

Exec Dt:

07/28/1997

Assignee:

SEIKO INSTRUMENTS, INC.

8, NAKASE 1-CHOME, MIHAMA-KU, CHIBA-SHI

CHIBA, JAPAN

Correspondent:

LOEB & LOEB LLP

WILLIAM H. WRIGHT

10100 SANTA MONICA BOULEVARD, 22ND FLOOR

LOS ANGELES, CA 90067-4164

Assignment: 2

Reel/Frame:

037723/0880

Recorded: 02/12/2016

Pages: 5

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignor:

SEIKO INSTRUMENTS INC.

Exec Dt:

01/29/2016

Assignee:

SII SEMICONDUCTOR CORPORATION

8, NAKASA 1-CHOME,

MIHAMA-KU, CHIBA-SHI

CHIBA, JAPAN 261-8507

Correspondent:

TERESA LAVENUE

555 THIRTEENTH STREET, N. W.

WASHINGTON, DC 20004

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