Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/22/2000
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Application #:
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09170633
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Filing Dt:
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10/13/1998
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Inventors:
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YOSHIHISA TAKASE, NAOKI OKAZAKI
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Title:
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METHOD OF FORMING ELECTRIC PAD OF SEMICONDUTOR DEVICE AND METHOD OF FORMING SOLDER BUMP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1006, OAZA KADOMA, KADOMA-SHI |
OSAKA, JAPAN 571 |
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RATNER & PRESTIA |
LAWRENCE E. ASHERY |
SUITE 301, ONE WESTLAKES, BERWYN |
P.O. BOX 980 |
VALLEY FORGE, PA 19482-0980 |
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