Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/07/2000
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Application #:
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08883570
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Filing Dt:
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06/26/1997
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Inventors:
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YASUNORI OHKUBO, HIROSHI SATOH, YOSHIHIRO MIYAZAWA
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Title:
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WAFER BONDING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-35, KITASHINAGAWA 6-CHOME |
| SHINAGAWA-KU, TOKYO, JAPAN |
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| HILL, STEADMAN & SIMPSON, P.C. |
| LEWIS T. STEADMAN |
| 85TH FLOOR SEARS TOWER |
| 233 S. WACKER DRIVE |
| CHICAGO, IL 60606 |
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