Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/28/2000
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Application #:
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09083968
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Filing Dt:
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05/26/1998
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Inventors:
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TAKUO FUNAYA, KOJI MATSUI
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Title:
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METHOD OF THERMOCOMPRESSION BONDING A SUPPORTING SUBSTRATE TO A SEMICONDUCTOR BARE CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME, MINATO-KU |
| TOKYO, JAPAN |
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| YOUNG & THOMPSON |
| LAUREN TERRY |
| 745 SOUTH 23RD STREET, SECOND FLOOR |
| ARLINGTON, VA 22202 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11TH FLOOR, DSM JIMBOCHO BUILDING, 1-11, KANDA JIMBOCHO, CHIYODA-KU |
| TOKYO, JAPAN 101-0051 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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