Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/11/2000
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Application #:
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09136424
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Filing Dt:
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08/20/1998
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Inventor:
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YONEDA YOSHIHIRO
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Title:
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FLIP CHIP MOUNTING SUBSTRATE WITH RESIN FILLED BETWEEN SUBSTRATE AND SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, KAMIKODANAKA, 4-CHOME NAKAHARA-KU, KAWASAKI-SHI |
| KANAGAWA 211-8588, JAPAN |
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| STAAS & HALSEY |
| DAVID M. PITCHER |
| 700 ELEVENTH STREET, N.W. |
| SUITE 500 |
| WASHINGTON, D.C. 20001 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OAZA KURITA, NAGANO-SHI |
| 711, AZA SHARIDEN |
| NAGANO 380-0921, JAPAN |
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| STAAS & HALSEY LLP |
| DAVID M. PITCHER |
| 700 ELEVENTH STREET, N.W., SUITE 500 |
| WASHINGTON, D.C. 20001 |
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