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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
05/16/2000
Application #:
09072399
Filing Dt:
05/04/1998
Inventors:
MIKE BRENNER, TIMOTHY J. HOGAN, LAWRENCE D. DYER, LISA A T LESTER, JOSEPH G. HARDEN
Title:
METHOD OF REDUCING WAFER PARTICLES AFTER PARTIAL SAW USING A SUPERHARD PROTECTIVE COATING
Assignment: 1
Reel/Frame:
009199/0209Recorded: 05/04/1998Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/14/1997
Exec Dt:
05/14/1997
Exec Dt:
05/15/1997
Exec Dt:
05/14/1997
Exec Dt:
05/14/1997
Assignee:
P.O. BOX 655474, M/S 3999
DALLAS, TEXAS 75265
Correspondent:
TEXAS INSTRUMENTS INCORPORATED
JULIE L. REED
P.O. BOX 655474, M/S 3999
DALLAS, TX 75265

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