Patent Assignment Abstract of Title
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For pending or abandoned applications please consult USPTO staff.
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2000
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Application #:
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08903996
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Filing Dt:
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07/31/1997
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Inventors:
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YOSHIKI SOTO, KOJI MIYATA, TOSHIO YAMAZAKI, FUMIO INOUE, HIDEHIRO NAKAMURA et al
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Title:
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SUBSTRATE FOR HOLDING A CHIP OF SEMI-CONDUCTOR PACKAGE, SEMI-CONDUCTOR PACKAGE, AND FABRICATION PROCESS OF SEMI-CONCUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHISHINJUKU, 2-CHOME, SHINJUKU-KU |
| TOKYO, JAPAN |
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| 22-22, NAGAIKECHO, ABENO-KU |
| OSAKA-SHI, OSAKA-FU, JAPAN |
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| PENNIE & EDMONDS LLP |
| CHARLES E. MILLER |
| 1155 AVENUE OF THE AMERICAS |
| NEW YORK, NEW YORK 10036 |
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