Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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05/23/2000
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Application #:
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09198309
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Filing Dt:
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11/23/1998
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Inventors:
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PING-WEI LIN, JUI-PING LI, MING-KUAN KAO, YI-FU CHUNG
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Title:
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METHOD FOR ENLARGING SURFACE AREA OF A PLURALITY OF HEMI-SPHERICAL GRAINS ON THE SURFACE OF A SEMICONDUCTOR CHIP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED, INDUSTRIAL PARK |
| NO. 1, CREATION ROAD I, |
| HSIN-CHU, TAIWAN R.O.C |
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| WINSTON HSU |
| 3F, NO. 52, LANE 46, MIN-SHENG RD. |
| YUNG-HO CITY |
| TAIPEI HSIEN, TAIWAN |
| R.O.C. |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3F, NO.19, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU CITY, TAIWAN |
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| MACPHERSON KWOK CHEN ET.AL. |
| MICHAEL SHENKER |
| 1762 TECHNOLOGY DRIVE, SUITE 226 |
| SAN JOSE, CA 95110 |
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