Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/06/2000
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Application #:
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09049559
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Filing Dt:
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03/27/1998
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Inventors:
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DETELF HOUDEAU, JOSEF KIRSCHBAUER, HANS-GEORG MENSCH, PETER STAMPKA et al
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Title:
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CHIP MODULE WITH HEAT INSULATION FOR INCORPORATION INTO A CHIP CARD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| POSTFACH 22 16 64 |
| ZT GG VM |
| MUNCHEN, GERMANY 80506 |
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| LERNER AND GREENBERG |
| RALPH E. LOCHER |
| PO BOX 2480 |
| HOLLYWOOD, FL 33022 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AM CAMPEON 1-12 |
| D-85579 NEUBIBERG, GERMANY |
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| CPA GLOBAL |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST. HELIER, JE1 1BL JERSEY |
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