Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/13/2000
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Application #:
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09031167
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Filing Dt:
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02/26/1998
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Inventors:
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WILLIAM JEFFERY SCHAEFER, PAI-HSIANG KAO, NIKHIL VISHWANATH KELKAR
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Title:
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SURFACE MOUNT DIE: WAFER LEVEL CHIP-SCALE PACKAGE AND PROCESS FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95052 |
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BEYER & WEAVER, LLP |
MARY R. OLYNICK |
P.O. BOX 61059 |
PALO ALTO, CA 94306 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE STATE OF INCORPORATION FROM CALIFORNIA TO DELAWARE FILED 6-15-98 RECORDED ON REEL 9251 FRAME 0499.
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2900 SEMICONDUCTOR DRIVE |
SANTA CLARA, CALIFORNIA 95051 |
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BETER & WEAVER, LLP |
STEVEN D. BEYER |
P.O. BOX 61059 |
PALO ALTO, CA 94304 |
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