Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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08978694
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Filing Dt:
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11/26/1997
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Inventors:
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TAKASHI FUJITA, YUZO KOZAI, MOTOYUKI OHARA
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Title:
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POLISHING PAD AND APPARATUS FOR POLISHING A SEMICONDUCTOR WAFER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| OSAKA-SHI |
| 5-33, KITAHAMA 4-CHOME, CHUO-KU |
| OSAKA, JAPAN |
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| BARNES & THORNBURG |
| MICHAEL S. GZYBOWSKI |
| 600 ONE SUMMIT SQUARE |
| FORT WAYNE, IN 46802 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO 107-8481, JAPAN |
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| BARNES & THORNBURG |
| PERRY PALAN |
| FRANKLIN TOWER BLDG. |
| 1401 EYE STREET, N.W., SUITE 500 |
| WASHINGTON, D.C. 20005 |
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