Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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08826162
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Filing Dt:
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03/27/1997
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Inventors:
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MIYUKI TAKENAKA, YUJI YAMADA, MASARU HAYASHI, HIDEKI MATSUNAGA, AKIRA OKADA
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Title:
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METHOD AND APPARATUS FOR ETCHING OF SILICON MATERIALS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| KANAGAWA-KEN |
| 72 HORIKAWA-CHO, SAIWAI-KU |
| KAWASAKI-SHI, JAPAN |
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| FOLEY & LARDNER |
| RICHARD L. SCHWAAB |
| 3000 K STREET, N.W. |
| SUITE 500 |
| WASHINGTON, DC 20007-5109 |
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