Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/20/2000
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Application #:
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09249881
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Filing Dt:
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02/16/1999
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Inventors:
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WEN-CHUN LIU, JUNG-JIE LIOU, CHIH-KUNG HUANG
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Title:
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LEAD FRAME STRUCTURE FOR PREVENTING THE WARPING OF SEMICONDUCTOR PACKAGE BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| EAST 1ST STREET |
| K.E.P.Z., KAOHSIUNG, TAIWAN, CHINA |
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| INDUSTRIAL PARK |
| NO. 6 SHIH CHIEN ROAD, HU KOU, HSINCHU |
| HSINCHU, TAIWAN, CHINA |
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| J.C. PATENTS, INC. |
| JIAWEI HUANG |
| 1340 REYNOLDS AVENUE |
| SUITE 114 |
| IRVINE, CA 92614 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1FL., NO. 172, SEC. 2, NANJING E. RD. |
| JUNGSHAN CHIU, TAIPEI 104, TAIWAN R.O.C. |
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| J. C. PATENTS, INC. |
| JIAWEI HUANG |
| 4 VENTURE, SUITE 250 |
| IRVINE, CA 92618 |
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