Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/04/2000
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Application #:
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09107801
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Filing Dt:
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06/30/1998
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Inventors:
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NIKHIL V KELKAR, WILLIAM J SCHAEFER, JOHN A JACKSON
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Title:
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CHIP-ON-CHIP INTEGRATED CIRCUIT PACKAGE AND METHOD FOR MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| BEYER & WEAVER, LLP |
| MARY O. OLYNICK |
| P.O. BOX 61059 |
| PALO ALTO, CA 94306 |
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Assignment:
2
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RECORD TO CORRECT THE STATE OF INCORPORATION FOR THE ASSIGNEE IN THE ASSIGNMENT DOCUMENT PREVIOUSLY RECORDED ON REEL 9303, FRAME 0589.
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| 2900 SEMICONDUCTOR DRIVE |
| SANTA CLARA, CALIFORNIA 95051 |
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| BEYER WEAVER & THOMAS LLP |
| STEVE D. BEYER |
| P.O. BOX 778 |
| BERKELEY, CA 94704-0778 |
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