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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
07/11/2000
Application #:
09055750
Filing Dt:
04/07/1998
Inventor:
SHIH-LI CHEN
Title:
CHIP SCALE PACKAGE
Assignment: 1
Reel/Frame:
009084/0387Recorded: 04/07/1998Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
03/10/1998
Assignee:
NO. 11, LANE 541, SEC. 1, CHUNG-SHING RD., CHUTUNG TOWN
HSINCHU HSIEN, TAIWAN ROC
Correspondent:
ROSENBERG, KLEIN & BILKER
MORTON J. ROSENBERG, ESQ.
3444 ELLICOTT CENTER DRIVE
SUITE 105
ELLICOTT CITY, MARYLAND 21043

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