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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
6099935
Issue Dt:
08/08/2000
Application #:
08573469
Filing Dt:
12/15/1995
Inventors:
WILLIAM BREARLEY, LAERTIS ECONOMIKOS, PAUL F. FINDEIS, KIMBERLEY A. KELLY et al
Title:
APPARATUS FOR PROVIDING SOLDER INTERCONNECTIONS TO SEMICONDUCTOR AND ELECTRONIC PACKAGING DEVICES
Assignment: 1
Reel/Frame:
007807/0244Recorded: 12/15/1995Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
BREARLEY, WILLIAM
Exec Dt:
12/13/1995
ECONOMIKOS, LAERTIS
Exec Dt:
12/13/1995
FINDEIS, PAUL F.
Exec Dt:
12/14/1995
KELLY, KIMBERLEY A.
Exec Dt:
12/13/1995
LEENSTRA, BOUWE W.
Exec Dt:
12/13/1995
MERRYMAN, ARTHUR
Exec Dt:
12/13/1995
PERFECTO, ERIC D.
Exec Dt:
12/13/1995
PRASED, CHANDRIKA
Exec Dt:
12/13/1995
WOOD, JAMES P.
Exec Dt:
12/13/1995
YU, ROY
Exec Dt:
12/13/1995
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
OLD ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
DONALD D. MONDUL
INTELLECTUAL PROPERTY LAW DEPT.
1580 ROUTE 52, DEPT. 18G/BLDG. 300482
HOPEWELL JUNCTION, NY 12533-6531

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