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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/29/2000
Application #:
09022687
Filing Dt:
02/12/1998
Inventors:
SHUHEI ISHIKAWA, TSUTOMU MITSUI
Title:
COMPOSITE MATERIAL FOR HEAT SINKS FOR SEMICONDUCTOR DEVICES AND METHOD FOR PRODUCING THE SAME
Assignment: 1
Reel/Frame:
008993/0470Recorded: 02/12/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/22/1998
Exec Dt:
01/22/1998
Assignee:
2-56, SUDA-CHO, MIZUHO-KU
NAGOYA-CITY, AICHI-PREF. 467-8530, JAPAN
Correspondent:
WALL MARJAMA & BILINSKI
STEPHEN P. BURR
217 MONTGOMERY STREET
HILLS BUILDING, 7TH FLOOR
SYRACUSE, NEW YORK 13202

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