Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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09/05/2000
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Application #:
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08862396
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Filing Dt:
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05/23/1997
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Inventors:
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MAKOTO ITO, KENJI OHSAWA
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Title:
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SEMICONDUCTOR PACKAGE AND THE MANUFACTURING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SHINAGAWA-KU |
| 7-35, KITASHINAGAWA 6-CHOME |
| TOKYO, JAPAN |
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| HILL, STEADMAN & SIMPSON, P.C. |
| JAMES D. HOBART |
| 85TH FLOOR SEARS TOWER |
| 233 S. WACKER DRIVE |
| CHICAGO, IL 60606 |
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