Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
09/12/2000
|
Application #:
|
09221062
|
Filing Dt:
|
12/28/1998
|
Inventor:
|
YUJI TANAKA
|
Title:
|
FLIP-CHIP BONDING PARTS, FLIP-CHIP BONDING CONFIRMATION PARTS AND A FLIP-CHIP BONDING METHOD
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
2-51-1, INADAIRA, MUSASHI MURAYAMA-SHI |
TOKYO, JAPAN |
|
|
|
KODA & ANDROLIA |
H. HENRY KODA |
10100 SANTA MONICA BLVD., SUITE 2340 |
LOS ANGELES, CA 90067 |
|
|
Search Results as of:
05/08/2024 07:39 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|