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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/19/2000
Application #:
09248993
Filing Dt:
02/12/1999
Inventors:
KIYOSHI SUZUKI, HISASHI MASUMURA, TERUAKI FUKAMI
Title:
POLISHING METHOD FOR SEMICONDUCTOR WAFER AND POLISHING PAD USED THEREIN
Assignment: 1
Reel/Frame:
009780/0653Recorded: 02/12/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/09/1999
Exec Dt:
02/08/1999
Exec Dt:
02/08/1999
Assignee:
TOGINBIRU, 4-2, MARUNOUCHI 1-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
EVENSON, MCKEOWN, EDWARDS, ETAL
J.D. EVANS
1200 G STREET, N.W., SUITE 700
WASHINGTON, D.C. 20005

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