Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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09/19/2000
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Application #:
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09147799
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Filing Dt:
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03/10/1999
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Inventors:
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TAKANORI KUSHIDA, AKIO KOBAYASHI, YOSUKE OBATA, HIRONORI IKEDA, TARO FUKUI et al
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Title:
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EPOXY RESIN SEALING MATERIAL FOR MOLDING SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1048, OAZA-KADOMA |
KADOMA-SHI, OSAKA 571, JAPAN |
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NIKAIDO, MARMELSTEIN, MURRAY & ORAM LLP |
GEORGE E. ORAM, JR. |
METROPOLITAN SQUARE, 655 15TH ST., N.W. |
SUITE 330 - G STREET LOBBY |
WASHINGTON, DC 20005-5701 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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1048, OAZA-KADOMA |
KADOMA-SHI, OSAKA, JAPAN 571-8686 |
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KENJI KAMATA |
PANASONIC PATENT CENTER |
1130 CONNECTICUT AVE., N.W. SUITE 1100 |
WASHINGTON, DC 20036 |
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