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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/19/2000
Application #:
09314591
Filing Dt:
05/19/1999
Inventors:
YONG KONG SIEW, LAP CHAN
Title:
MODIFIED BURIED CONTACT PROCESS FOR IC DEVICE FABRICATION
Assignment: 1
Reel/Frame:
009976/0030Recorded: 05/19/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/30/1999
Exec Dt:
04/30/1999
Assignee:
60 WOODLANDS INDUSTRIAL PARK D
STREET 2, SINGAPORE 73840
Correspondent:
GEORGE O. SAILE
20 MCINTOSH DRIVE
POUGHKEEPSIE, NY 12603

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