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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
10/03/2000
Application #:
08901239
Filing Dt:
07/25/1997
Inventors:
YOSHIO IDA, AKIYOSHI TAINAKA
Title:
MOLDED ELECTRONIC COMPONENT HAVING PRE-PLATED LEAD TERMINALS AND MANUFACTURING PROCESS THEREOF
Assignment: 1
Reel/Frame:
009099/0518Recorded: 02/09/1998Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/03/1997
Exec Dt:
09/03/1997
Assignee:
MINATO-KU
7-1, SHIBA 5-CHOME
TOKYO, JAPAN
Correspondent:
SUGHRUE, MION, ZINN, MACPEAK & SEAS
J. FRANK OSHA, ESQ.
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3202
Assignment: 2
Reel/Frame:
013019/0549Recorded: 06/24/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/06/2002
Assignee:
7-1, KORIYAMA 6-CHOME
TAIHAKU-KU, SENDAI-SHI, MIYAGI, JAPAN
Correspondent:
SUGHRUE MION, PLLC
FRANK OSHA
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, D.C. 20037-3213

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