Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/17/2000
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Application #:
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09172862
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Filing Dt:
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10/15/1998
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Inventor:
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KEIJI NAGAI
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Title:
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SEMICONDUCTOR DEVICE WITH PLATE HEAT SINK FREE FROM CRACKS DUE TO THERMAL STRESS AND PROCESS FOR ASSEMBLING IT WITH PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-1, SHIBA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN |
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| SUGHRUE, MION, ZINN, MACPEAK & SEAS |
| J. FRANK OSHA, ESQ. |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, D.C. 20037-3213 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU |
| KAWASAKI-SHI, KANAGAWA 211-8666, JAPAN |
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| SUGHRUE MION, PLLC |
| J. FRANK OSHA |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037-3213 |
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