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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
10/24/2000
Application #:
08874902
Filing Dt:
06/13/1997
Inventors:
LAWRENCE ROBERT BLUMBERG, ROBERT MAYNARD JAPP, WILLIAM JOHN RUDIK, JOHN FRANK SUROWKA
Title:
METHOD FOR REDUCING COEFFICIENT OF THERMAL EXPANSION IN CHIP ATTACH PACKAGES
Assignment: 1
Reel/Frame:
008894/0867Recorded: 01/08/1998Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/15/1997
Exec Dt:
12/15/1997
Exec Dt:
12/22/1997
Exec Dt:
12/09/1997
Assignee:
ARMONK, NEW YORK 10504
Correspondent:
CALFEE HALTER & GRISWOLD LLP
MARY E. GOLRICK
800 SUPERIOR AVENUE
SUITE 1400
CLEVELAND, OHIO 44114

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