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Patent Assignment Abstract of Title

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Total Assignments: 1

Patent #:	6144100	Issue Dt:	11/07/2000	Application #:	08959410	Filing Dt:	10/28/1997
Inventors:	CHI-CHEONG SHEN, DONALD C ABBOTT, WALTER BUCKSCH, MARCO CORSI, TAYLOR RICE EFLAND et al
Title:	INTEGRATED CIRCUIT WITH BONDING LAYER OVER ACTIVE CIRCUITRY

Assignment: 1

Reel/Frame:

008799/0737

Recorded: 10/28/1997

Pages: 11

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

SHEN, CHI-CHEONG

Exec Dt:

04/28/1997

ABBOTT, DONALD C.

Exec Dt:

04/18/1997

BUCKSCH, WALTER

Exec Dt:

04/30/1997

CORSI, MARCO

Exec Dt:

04/18/1997

EFRAND, TAYLOR RICE

Exec Dt:

05/22/1997

ERDELJAC, JOHN P.

Exec Dt:

04/28/1997

HUTTEN, LOUIS N.

Exec Dt:

04/28/1997

MAI, QUANG X.

Exec Dt:

04/25/1997

WAGENSOHNER, KONRAD

Exec Dt:

04/30/1997

WILLIAMS, CHARLES EDWARD

Exec Dt:

05/30/1997

Assignee:

TEXAS INSTRUMENTS INCORPORATED

M.S. 219

P.O. BOX 655474

DALLAS, TEXAS 75265

Correspondent:

TEXAS INSTRUMENTS INCORPORATED

W. JAMES BRADY III

P.O. BOX 655474, M.S. 219

DALLAS, TEXAS 75265

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