Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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11/21/2000
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Application #:
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09260471
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Filing Dt:
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03/02/1999
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Inventors:
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SE-CHUL PARK, KYU-HAN LEE, JU-BONG KIM, SUNG-LI KANG, DONG-IL SHIN, BAE-SOON JANG
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Title:
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LEAD FRAME FOR SEMICONDUCTOR PACKAGE AND LEAD FRAME PLATING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 28 SUNGJU-DONG, CHANGWON-CITY |
| KYONGSANGNAM-DO, KOREA, REPUBLIC OF |
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| FINNEGAN, HENDERSON, FARABOW, ETAL |
| ERNEST F. CHAPMAN |
| 1300 I STREET, N.W. |
| WASHINGTON, D.C. 20005 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 84, JEONGDONG-RO, SEONGSAN-GU, |
| GYEONGSANGNAM-DO, |
| CHANGWON-SI, KOREA, REPUBLIC OF 641-120 |
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| SUGHRUE MION |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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Assignment:
3
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 726, UNGNAM-RO, SEONGSAN-GU, |
| GYEONGSANGNAM-DO |
| CHANGWON-SI, KOREA, REPUBLIC OF 642-120 |
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| SUGHRUE MION, PLLC |
| 2100 PENNSYLVANIA AVENUE, N.W. |
| SUITE 800 |
| WASHINGTON, DC 20037 |
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