Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/28/2000
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Application #:
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09208245
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Filing Dt:
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12/09/1998
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Inventors:
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MINH VAN NGO, ROBIN W. CHEUNG
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Title:
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METHOD OF FORMING HIGH DENSITY CAPPING LAYERS FOR COPPER INTERCONNECTS WITH IMPROVED ADHESION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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P.O. BOX 3453 |
ONE AMD PLACE |
SUNNYVALE, CALIFORNIA 94088 |
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MCDERMOTT, WILL & EMERY |
ARTHUR J. STEINER |
99 CANAL CENTER PLAZA |
SUITE 300 |
ALEXANDRIA, VA 22314 |
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