Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/12/2000
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Application #:
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09335922
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Filing Dt:
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06/18/1999
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Inventors:
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YUTAKA KOMA, MOTOMI KITANO, TAKASHI KOUDA
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Title:
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SEMICONDUCTOR WAFER GRINDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 14-3, HIGASHI-KOHJIYA 2-CHOME |
| TOKYO, 144-033, JAPAN |
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| NIKAIDO, MARMELSTEIN, MURRAY & ORAM LLP |
| GEORGE E. ORAM, JR. |
| METROPOLITAN SQUARE, 655 15TH ST., N.W. |
| SUITE 330 - G STREET LOBBY |
| WASHINGTON, DC 20005-5701 |
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