Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/12/2000
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Application #:
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09276779
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Filing Dt:
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03/25/1999
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Inventor:
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HIEP LE
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Title:
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IMPROVED PRESS-FIT SEMICONDUCTOR PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 12TH FLOOR, SECTION 1 |
| TUNG HWA S. ROAD |
| TAIPEI, TAIWAN R.O.C |
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| SNELL & WILMER L.L.P. |
| DANIEL R. POTE |
| ONE ARIZONA CENTER |
| 400 E. VAN BUREN |
| PHOENIX, AZ 85004-0001 |
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