Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/26/2000
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Application #:
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09340221
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Filing Dt:
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06/25/1999
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Inventor:
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SIEW HOR KUAN
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Title:
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FAULT ISOLATION WITHIN AN INNER LEAD BOND REGION OF A UBGA (MICRO BALL GRID ARRAY) PACKAGE FOR AN INTEGRATED CIRCUIT DIE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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| LAW OFFICE OF MONICA H. CHOI |
| MONICA H. CHOI |
| P.O. BOX 3424 |
| DUBLIN, OHIO 43016-0204 |
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