Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/09/2001
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Application #:
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09076264
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Filing Dt:
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05/12/1998
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Inventors:
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ZENZO ISHIJIMA, JUNICHI ICHIKAWA, HIDEO SHIKATA, TAMIO TAKADA
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Title:
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THIN PLATE MEMBER FOR SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 520 MINORIDAI, MATSUDO-CHI |
| CHIBA, JAPAN |
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| JONES & ASKEW, LLP |
| ROGER T. FROST |
| 37TH FLOOR, 191 PEACHTREE STREET, N.E. |
| ATLANTA, GEORGIA 30303-1769 |
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