Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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01/09/2001
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Application #:
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09182195
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Filing Dt:
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10/30/1998
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Inventor:
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JONG HYUN LEE
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Title:
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LAYER-TYPE BALL GRID ARRAY SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, HYANGJEONG-DONG, HUNGDUK-GU CHEONGJU |
| CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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| FLESHNER & KIM |
| CARL R. WESOLOWSKI |
| P.O. BOX 221200 |
| CHANTILLY, VIRGINIA 20153-1200 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB |
| ICHON-SHI, KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| FLESHNER & KIM, LLP |
| CARL R. WESOLOWSKI |
| P.O. BOX 221200 |
| CHANTILLY, VA 20153-1200 |
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