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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/16/2001
Application #:
09276254
Filing Dt:
03/25/1999
Inventors:
KENZO ISHIDA, SHUJI INOUE
Title:
COOLING UNIT FOR AN INTEGRATED CIRCUIT PACKAGE
Assignment: 1
Reel/Frame:
009863/0255Recorded: 03/25/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/23/1999
Exec Dt:
03/23/1999
Assignee:
2200 MISSION COLLEGE BOULEVARD
SANTA CLARA, CALIFORNIA 95052
Correspondent:
BLAKELY, SOKOLOFF, TAYLOR, ET AL.
BEN J. YORKS
12400 WILSHIRE BOULEVARD
7TH FLOOR
LOS ANGELES, CA 90025

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