Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/06/2001
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Application #:
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09519879
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Filing Dt:
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03/06/2000
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Inventors:
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Satoru Ide, Tsutomu Yamada, Norio Hayashi
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Title:
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Method of detecting end point of polishing of wafer and apparatus for detecting end point of polishing
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| YOKOHAMA-SHI |
| 2-7-3, MINOWA-CHO, KOHOKU-KU |
| KANAGAWA 223-8533, JAPAN |
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| OBLON, SPIVAK, MCCLELAND, MAIER ET AL |
| NORMAN F. OBLON |
| FOURTH FLOOR |
| 1755 JEFFERSON DAVIS HIGHWAY |
| ARLINGTON, VIRGINIA 22202 |
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