Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/13/2001
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Application #:
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08950284
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Filing Dt:
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10/14/1997
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Inventors:
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TOSHINORI OGASHIWA, TAKATOSHI ARIKAWA, MASAMI YOKOZAWA, KAZUHIRO AOI, YOSHIHARU SAWADA
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Title:
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SOLDER MATERIAL AND ELECTRONIC PART USING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006-BANCHI, OAZA-KADOMA, KADOMA-SHI |
| OSAKA 571, JAPAN |
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| 2-6-6, KAYABACHO, NIHONBASHI, CHUO-KU |
| TOKYO 103, JAPAN |
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| MERCHANT GOULD SMITH ET AL |
| DOUGLAS P. MUELLER |
| 3100 NORWEST CENTER |
| 90 SOUTH SEVENTH STREET |
| MINNEAPOLIS, MN 55402-4131 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1006-BANCHI, OAZA-KADOMA |
| KADOMA-SHI, OSAKA 571-8501, JAPAN |
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| MERCHANT & GOULD P.C. |
| DOUGLAS P. MUELLER |
| P.O. BOX 2903 |
| MINNEAPOLIS, MN 55402-0903 |
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