Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/13/2001
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Application #:
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09046136
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Filing Dt:
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03/23/1998
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Inventors:
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KYUNG WOOK PAIK, JIN SU KIM, HYOUNG SOO KO
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Title:
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STACKED SEMICONDUCTOR CHIP PACKAGE HAVING EXTERNAL TERMINAL PADS AND STACKABLE CHIPS HAVING A PROTECTION LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1, HYANGJEONG-DONG, HUNGDUK-GU, CHEONGJU |
| CHOONGCHEONGBUK-DO, KOREA, REPUBLIC OF |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| TERRY L. CLARK |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHON -SHI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP |
| P.O. BOX 747 |
| FALLS CHURCH, VA 22040-0747 |
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