Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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02/20/2001
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Application #:
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09052104
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Filing Dt:
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03/31/1998
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Inventors:
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YASUHIRO HIRANO, TOSHIAKI HAYASHI
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Title:
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EPOXY RESIN COMPOSITION AND RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 5-33, KITAHAMA 4-CHOME, CHUO-KU |
| OSAKA 541-8550, JAPAN |
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| PILLSBURY MADISON & SUTRO LLP |
| KENDREW H. COLTON |
| 1100 NEW YORK AVENUE, N.W. |
| NINTH FLOOR, EAST TOWER |
| WASHINGTON, D.C. 20005-3918 |
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Assignment:
2
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| 27-1, SHINKAWA 2-CHOME |
| CHUO-KU |
| TOKYO, JAPAN 104-8260 |
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| FITCH, EVEN, TABIN & FLANNERY |
| KENDREW H. COLTON |
| 1801 K STREET, NW, SUITE 401L |
| WASHINGTON, D.C. 20006-1201 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7TH FLOOR, NO. 301, SONGKIANG ROAD |
| TAIPEI, TAIWAN, CHINA |
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| SAFIYA JARVIS |
| 111 HUNTINGTON AVENUE |
| BOSTON, MA 02199 |
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