Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2001
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Application #:
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09602733
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Filing Dt:
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06/26/2000
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Inventors:
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Prakorn Vijchulata, Watana Sabyeying
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Title:
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Determination of quality of bonding between a conductive ball and a conductive pad within an IC package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE AMD PLACE |
| SUNNYVALE, CALIFORNIA 94088 |
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| LAW OFFICES OF MONICA H. CHOI |
| MONICA H. CHOI |
| P.O. BOX 3424 |
| DUBLIN, OHIO 43016-0204 |
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