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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/27/2001
Application #:
09102212
Filing Dt:
06/22/1998
Inventors:
FUMIO YOSHIKAWA, HIDEYUKI FUKASAWA, MITSUGU SHIRAI, HIDEAKI SASAKI, TOSHITAKA MURAKAWA et al
Title:
PASTE PROVIDING METHOD, SOLDERING METHOD AND APPARATUS AND SYSTEM THEREFOR
Assignment: 1
Reel/Frame:
011386/0021Recorded: 12/06/2000Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/15/1998
Exec Dt:
06/15/1998
Exec Dt:
06/15/1998
Exec Dt:
06/15/1998
Exec Dt:
06/15/1998
Exec Dt:
06/15/1998
Assignee:
6, KANDA SURUGADAI 4-CHOME, CHIYODA-KU
TOKYO, JAPAN
Correspondent:
ANTONELLI, TERRY, STOUT & KRAUS, LLP
CARL I. BRUNDIDGE
1300 NORTH SEVENTEENTH STREET
SUITE 1800
ARLINGTON, VA 22209

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