Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/27/2001
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Application #:
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09194434
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Filing Dt:
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12/01/1998
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Inventors:
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HIDEO HONMA, TOMOYUKI FUJINAMI, YOSHITAKA TERASHIMA, SHINJI HAYASHI, SATORU SHIMIZU
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Title:
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ELECTROLESS COPPER PLATING SOLUTION AND METHOD FOR ELECTROLESS COPPER PLATING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8-1-60, SUGITA, ISOGO-KU, YOKOHAMA-SHI |
| KANAGAWA-KEN 235, JAPAN |
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| 18-8, HIGASHIUENO 2-CHOME, TAITO-KU |
| TOKYO 110, JAPAN |
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| OBLON SPIVAK MCCLELLAND MAIER & NEUSTADT |
| NORMAN F. OBLON |
| 1755 JEFFERSON DAVIS HIGHWAY |
| FOURTH FLOOR |
| ARLINGTON, VA 22202 |
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