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Patent Assignment Abstract of Title
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Total Assignments: 7
Patent #:
6198294
Issue Dt:
03/06/2001
Application #:
09312776
Filing Dt:
05/17/1999
Inventor:
ANDREW J. BLACK
Title:
IN-SITU BACKGRIND WAFER THICKNESS MONITOR
Assignment: 1
Reel/Frame:
009986/0239Recorded: 05/17/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
BLACK, ANDREW J.
Exec Dt:
05/10/1999
Assignee:
VLSI TECHNOLOGY, INC.
LEGAL DEPARTMENT, MS/45
1109 MCKAY DRIVE
SAN JOSE, CALIFORNIA 95131
Correspondent:
DOUGLAS L. WELLER
431 MAGNOLIA LANE
SANTA CLARA, CA 95051
Assignment: 2
Reel/Frame:
018635/0570Recorded: 12/15/2006Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
VLSI TECHNOLOGY, INC.
Exec Dt:
07/02/1999
Assignee:
PHILIPS SEMICONDUCTORS VLSI INC.
1251 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10020
Correspondent:
ELIZABETH PARSONS
1825 EYE STREET, NW
WASHINGTON, DC 20006
Assignment: 3
Reel/Frame:
010237/0446Recorded: 09/17/1999Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
BLACK, ANDREW J.
Exec Dt:
09/03/1999
Assignee:
VLSI TECHNOLOGY, INC.
1109 MCKAY DRIVE
LEGAL DEPARTMENT, MS/45
SAN JOSE, CALIFORNIA 95131
Correspondent:
DOUGLAS L. WELLER
431 MAGNOLIA LANE
SANTA CLARA, CA 95051
Assignment: 4
Reel/Frame:
018668/0255Recorded: 12/22/2006Pages: 21
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
PHILIPS SEMICONDUCTORS VLSI INC.
Exec Dt:
12/20/1999
Assignee:
PHILIPS SEMICONDUCTORS INC.
1251 AVENUE OF THE AMERICAS
NEW YORK, NEW YORK 10020
Correspondent:
ELIZABETH PARSONS
1825 EYE STREET, NW
WASHINGTON, DC 20006
Assignment: 5
Reel/Frame:
043951/0127Recorded: 09/22/2017Pages: 124
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
KONINKLIJKE PHILIPS ELECTRONICS N.V.
Exec Dt:
09/28/2006
Assignee:
PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
HIGH TECH CAMPUS 60
EINDHOVEN, NETHERLANDS 5656 AG
Correspondent:
NXP B.V.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TX 78735
Assignment: 6
Reel/Frame:
043951/0611Recorded: 09/22/2017Pages: 13
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
PHILIPS SEMICONDUCTORS INTERNATIONAL B.V.
Exec Dt:
09/29/2006
Assignee:
NXP B.V.
HIGH TECH CAMPUS 60
EINDHOVEN, NETHERLANDS 5656 AG
Correspondent:
NXP B.V.
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TX 78735
Assignment: 7
Reel/Frame:
018645/0779Recorded: 12/15/2006Pages: 37
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
PHILIPS SEMICONDUCTORS INC.
Exec Dt:
11/30/2006
Assignee:
NXP B.V.
HIGH TECH CAMPUS 60
5656 AG EINDHOVEN, NETHERLANDS
Correspondent:
ELIZABETH PARSONS
1825 EYE STREET, NW
WASHINGTON, DC 20006

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