Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/13/2001
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Application #:
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09471055
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Filing Dt:
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12/22/1999
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Inventors:
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CHENG-YUAN TSAI, CHIH-CHIEN LIU, MING-SHENG YANG
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Title:
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METHOD OF FORMING AN INTERMETAL DIELECTRIC LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD., II., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN R.O.C |
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| THOMAS, KAYDEN ET AL |
| DANIEL R. MCCLURE |
| 100 GALLERIA PARKWAY, SUITE 1750 |
| ATLANTA, GEORGIA 30339 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 3, LI-HSIN RD. 2 |
| HSINCHU, TAIWAN R.O.C |
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| HICKMAN COLEMAN & HUGHES, LLP |
| PAUL L. HICKMAN |
| P.O. BOX 52037 |
| PALO ALTO, CA 94303-0746 |
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