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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/20/2001
Application #:
08966863
Filing Dt:
11/10/1997
Inventors:
TAKAO ABE, NORIHIRO KOBAYASHI
Title:
HEAT TREATMENT METHOD FOR A SILICON WAFER AND A SILICON WAFER HEAT-TREATED BY THE METHOD
Assignment: 1
Reel/Frame:
008818/0264Recorded: 11/10/1997Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/27/1997
Exec Dt:
10/27/1997
Assignee:
4-2, MARUNOUCHI 1-CHOME
CHIYODA-KU, TOKYO, JAPAN
Correspondent:
OLIFF & BERRIDGE, PLC
JAMES A. OLIFF
P.O. BOX 19928
ALEXANDRIA, VA 22320

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