Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/27/2001
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Application #:
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09445275
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Filing Dt:
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02/23/2000
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Inventors:
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SHINSUKE HAGIWARA, FUMIO FURUSAWA, SEIICHI AKAGI, HARUAKI SUE, KAZUYOSHI TENDO
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Title:
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PHENOLIC RESIN, RESIN COMPOSITION, MOLDING MATERIAL FOR ENCAPSULATION, AND ELECTRONIC COMPONENT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-1, NISHISHINJUKU 2-CHOME, SHINJUKU-KU |
TOKYO 163-0449, JAPAN |
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PENNIE & EDMONDS LLP |
CHARLES E. MILLER |
1155 AVENUE OF THE AMERICAS |
NEW YORK, NY 10036 |
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