Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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04/03/2001
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Application #:
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09292742
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Filing Dt:
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04/16/1999
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Inventors:
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SU TAO, CHUN-HUNG LIN, TAI-CHUN HUANG
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Title:
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SEMICONDUCTOR PACKAGE WITH WIRE PROTECTION AND METHOD THEREFOR
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NANTZE EXPORT PROCESSING ZONE |
| NO. 26, CHIN 3RD ROAD |
| KAOHSIUNG, TAIWAN R.O.C |
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| WATSON COLE GRINDLE WATSON |
| JOHN P. DELUCA |
| 1400 K STREET, N.W. |
| 10TH FLOOR |
| WASHINGTON, DC 20005-2477 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NANTZE EXPORT PROCESSING ZONE |
| NO. 26, CHIN 3RD ROAD |
| KAOHSIUNG, TAIWAN |
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| WATSON COLE GRINDLE WATSON |
| JOHN P. DELUCA |
| 1400 K STREET, N.W. |
| 10TH FLOOR |
| WASHINGTON, DC 20005-2477 |
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